System and method for design, procurement and manufacturing collaboration

ABSTRACT

A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device&#39;s engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.

RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.10/372,022, filed Feb. 21, 2003 by the same inventors and now issued asU.S. Pat. No. 7,134,096, which claims priority to U.S. ProvisionalPatent Application Ser. No. 60/359,424, filed on Feb. 22, 2002 by atleast one common inventor, both of which are incorporated herein byreference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to the design and manufacture ofelectronic components, and more particularly to a schematic design toolcapable of integrating design and procurement analysis at the designstage of a component.

2. Description of the Background Art

Computer Aided Design (CAD) systems are well known and widely used inthe design of electronic circuits. Known systems allow the designer toenter objects into an electronic drawing file and to connect the objectsin order to “draw” the circuit being designed.

While some CAD systems appear quite complex, and offer the designer agreat variety of drawing tools, such programs are essentially onlydrawing engines. The objects in the drawing files are only arcs,circles, lines, etc. While the arcs, circles, and lines can be groupedto provide the appearance of an object (e.g., a transistor symbol, adevice package, text labels, etc.), the object is still only a group ofarcs, circles, lines, etc. The CAD program does not recognize the objectas an entity having any real physical characteristics (e.g., devicetype, function, etc.).

FIG. 1 illustrates the conventional process of bringing an electroniccomponent from conception to manufacturing. In an initial concept stage102 the gross structure, purpose, function, etc. of the electroniccomponent is conceived. Then, in a schematic design stage 104, thedesigner reduces the concept to a schematic drawing. As described above,the schematic drawing is simply a picture of a circuit, with symbolsrepresenting the various electronic devices (resistors, transistors,capacitors, etc.). Then, in a third step 106, the schematic drawing issent to a printed circuit board (PCB) designer, where one or more PCBsare designed for the electronic component. PCB design stage 106 is verytime consuming, requiring that the designer identify each device in thedrawing, assemble the engineering data (device type, value, packaging,footprint, etc.) for each device, identify the interconnectivity of thedevices in the drawing, and then layout the PCB. Next, in a fourth step108, the PCB is fabricated.

In a fifth stage 110, a copy of the schematic drawing is alsotransferred to a Product Introduction Center (PIC), where the electronicdevices necessary to build the electronic component are purchased. Inorder to reduce the time to market for the component, PCB design stage106 and PIC buy stage 110 typically occur simultaneously. In some cases,it is necessary for the PIC to select and/or substitute for electronicdevices in the design. The result is that the design being used by thePCB fab might vary slightly from the design being used by the PIC.

Next, in a sixth stage 112, a prototype is assembled, and the designundergoes DFx analysis (e.g., design for manufacturability, design fortestability, design for fabrication, design for quality, design forreliability, etc.). If the results of the DFx analysis isunsatisfactory, then the component design is returned to the designstage 104 to remedy any perceived defects. Typically, a design will gothrough several iterations before being acceptable for high volumemanufacturing.

Once the component design is found acceptable in the prototype and DFxstage 112, the design is forwarded to a high volume facility, where in aseventh stage 114 a supply chain for the component devices is set up,and additional DFx analysis is performed. Any necessary design revisionsare made, and the revised design is forwarded to a high volumeprocurement stage 116, where the electronic devices required formanufacturing the designed component are acquired. Finally, in a ninthstage 118, the components are manufactured.

Note that there is feed back from the high volume procurement stage 116and the manufacturing stage 118 to the supply chain setup stage 114, inorder to fine-tune the supply chain. However, note that there is nofeedback from any of stages 114, 116, or 118 to the schematic designstage 104. Therefore, any design errors corrected in stage 114, willrecur if new revisions of the design flow from schematic design stage104 through to manufacturing stage 118.

In summary, the multiple redesigns in the initial design stage, andrepetition of design errors resulting from a lack of feedback frommanufacturing to design, all contribute to an increased time to marketand increased design cost. What is needed, therefore, is a system andmethod for designing an electronic component that reduces the number ofredesigns necessitated by procurement processes. What is also needed isa system and method that reduces the number of times a design error isintroduced into the design to manufacturing flow. What is also needed isa system and method that facilitates easy annotation of design changes.

SUMMARY

The present invention overcomes the problems associated with the priorart by providing a system and method for integrating an electroniccomponent design tool with business rules filters and design analysisprocesses. One aspect of the invention facilitates designing componentswith devices that are preferred from a procurement standpoint, therebyreducing the need for subsequent procurement based design changes.Another aspect of the invention facilitates the performance ofmanufacturability and/or modeling tests at the design stage, therebyreducing the need for subsequent manufacturing based design changes.

A method for designing an electronic component includes receiving adevice criteria (e.g., a parametric value, procurement value, etc.) froma designer, querying a database for devices corresponding to the searchcriteria, querying the database for procurement data and/or engineeringdata associated with the corresponding devices, presenting the devicesto the designer based on the procurement data, and receiving input fromthe designer identifying one of the presented devices as a selecteddevice. In a particular method, the returned devices are sorted based onone or more procurement values (e.g., manufacturer, price, availability,manufacturer status, etc.), and presented to the designer in a rankedlist.

Objects representative of the selected devices are then entered into adesign file, and the objects are associated with the device'sengineering and/or procurement data. In a particular embodiment, theobjects are associated with the engineering data by embedding theengineering data in the file object. Optionally, data can be associatedwith the objects via links to the database. Types of engineering datathat can be associated with design file objects include, but are notlimited to, device footprint data, device pinout data, device physicaldimension data, parametric data, and packaging data. Additionally,connection data and annotation data can be entered into the design fileobjects by the designer.

Associating procurement and/or engineering data with design file objectsfacilitates the performance of operational and manufacturabilitytesting. In one method, design rules are retrieved and used to run testson the design file. The type of design tests run include, but are notlimited to design for manufacturability, design for testability, designfor fabrication, design for quality, and design for reliability.Additionally, predictive modeling tests can be run on the design file,because the file objects are associated with parametric data. Further,design for procurement test can be run, because the file objects areassociated with procurement data. The foregoing test can be run asdevices are placed in the design file, or when the design is complete,depending on the nature of the particular test and the designer'spreference.

Feedback can be provided from manufacturing processes to the designstage by updating the design rules. Similarly, feedback can be providedfrom a procurement department to the designer, by updating theprocurement data in the database. Such feedback is believed to beunknown in the prior art.

In another particular method, post-design reports are generated that areuseful in subsequent manufacturing processes. Examples of such reportsinclude, but are not limited to, a net list (defines deviceinterconnections) and a bill of materials (BOM).

Computer-readable media having code embodied therein for causing acomputer to facilitate the methods of the present invention are alsodisclosed.

A system for designing electronic components is also described. Thesystem includes a designer interface for receiving data and commandsfrom a designer, and a schematic design tool. The schematic design toolis responsive to receiving device criteria (e.g., parametric data) fromthe designer, and operative to query a database for devices satisfyingthe device criteria and for procurement data associated with thedevices, and to present the devices to the designer based on theprocurement data. The design tool is then operative to receive inputfrom the designer indicating that one of the displayed devices isselected, to insert an object representative of the selected device intoa design file, and to associate the procurement data with the fileobject. Engineering data associated with the device can also beassociated with the file object.

A particular embodiment further includes a bill of materials generatoroperative to generate a bill of materials from the procurement and/orengineering data associated with objects in the design file. Anotherparticular embodiment includes a net list generator operative togenerate a net list from the engineering data associated with objects inthe design file. Another embodiment includes a design analyzer (DFx,predictive modeling, etc.) operative to perform design analysis on thedesign file.

Innovative data structures for storing data in parts databases are alsodisclosed.

Innovative data structures for associating procurement and/orengineering data with objects in a design file are also disclosed.

Innovative business methods for taking electronic components from aconception stage to and through a manufacturing process are alsodisclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is described with reference to the followingdrawings, wherein like reference numbers denote substantially similarelements:

FIG. 1 illustrates a prior art process of taking an electronic componentfrom conception to manufacturing;

FIG. 2 illustrates a process of taking an electronic component fromconception to manufacturing according to one embodiment of the presentinvention;

FIG. 3 is a relational diagram illustrating the integration ofprocurement and design analysis at the design stage of a component;

FIG. 4 is a block diagram showing the flow of engineering andprocurement data to a designer's desktop;

FIG. 5 is a diagram showing an example data structure for the supplychain data shown in FIG. 4;

FIG. 6 is a diagram showing an example data structure for the privateengineering data shown in FIG. 4;

FIG. 7 is a diagram showing an example data structure for the publicengineering data shown in FIG. 4;

FIG. 8 is a block diagram showing a system for designing an electroniccomponent according to one embodiment of the present invention;

FIG. 9 is a block diagram showing a designer system of FIG. 8 in greaterdetail;

FIG. 10 is a diagram showing an example data structure for the schematicdesign file of FIG. 9;

FIG. 11 is a flow chart summarizing one particular method for designingan electronic component according to the present invention; and

FIG. 12 is a flow chart summarizing one particular method for selectinga device for use in a design based on procurement data associated withthe device.

DETAILED DESCRIPTION

The present invention overcomes the problems associated with the priorart, by integrating supply chain information and/or DFx analysis with aschematic design tool. In the following description, numerous specificdetails are set forth (e.g., particular data structures, particulartypes of DFx analysis, etc.) in order to provide a thoroughunderstanding of the invention. Those skilled in the art will recognize,however, that the invention may be practiced apart from these specificdetails. In other instances, details of well-known computer programmingpractices (e.g., provision of APIs, database management, etc.) have beenomitted, so as not to unnecessarily obscure the present invention.

FIG. 2 illustrates a process 200 of taking an electronic component fromconception to manufacture according to one aspect of the presentinvention. The first conception stage 202 is not unlike the conceptionstage 102 in the process of the prior art. In the design stage 204,however, the component is designed using a schematic design tool thataccesses and uses supply chain (procurement) and/or DFx resources duringthe initial design stage. The function of the schematic design tool willbe described in greater detail below. For the purpose of understandingprocess 200, it is sufficient to know that the schematic design toolselects devices based on procurement criteria, and then embeds (eitherdirectly or via links) procurement and engineering data in the designfile. Selecting devices for inclusion in the design based on procurementdata eliminates or at least greatly reduces the number of design changesrequired during later procurement processes. Embedding engineering data(e.g., device footprints, pinouts, etc.) in the design file enables thedesign tool to perform DFx analyses on the component at the designstage, thereby eliminating or at least greatly reducing the number ofredesigns necessary to ensure the manufacturability of the design.

Embedding engineering and procurement data also simplifies subsequentstages of process 200, by enabling the schematic design tool to produceoutput useful in subsequent processes. For example, the design tool canautomatically generate a net list (connectivity, device types,footprints, pinouts, etc.) for use in the PCB design 206 and fabrication208 processes. As another example, the schematic design tool canautomatically generate a bill of materials (BOM) for use in the PIC buyprocess 210. Further, because the devices used in the component wereselected based on procurement data, and the design file already includesthe procurement data, no additional supply chain setup is required.Thus, method 200 can proceed directly from the PIC buy process to thehigh volume procurement process 212.

The PIC prototype and DFx process 214 is similar to the analogousprocess in the prior art, except that the number of DFx issues requiringdesign changes is greatly reduced. Because the high volume procurementprocess 212 can now be performed essentially concurrently with the PICbuy process 210, process 200 can proceed to a ramp up process 216 toramp up to high volume manufacturing as soon as the design passes theDFx analysis in process 214.

Finally, note that there is a feedback loop (including 2-way designchange annotation) between the manufacturing ramp up process 216 and thedesign process 204. Mechanisms of providing this feedback will bedescribed below with reference to example embodiments of the invention.

FIG. 3 is a relational diagram 300 illustrating how design analysis andprocurement information are provided at the designers desktop. CADdesign 302 is a schematic design tool with which a designer can designelectronic components. Aggregated database 304 is a database ofelectronic devices that includes procurement data and engineering dataassociated with the electronic devices stored therein. CAD design system302 queries database 304 for devices meeting the designer's criteria,then the devices along with the associated engineering data andprocurement data are placed in component design files.

Aggregated database 304 can be updated and/or augmented in a number ofways. For example, suppliers (1-n) can update some of the procurement(price, availability, etc.) and/or engineering data (packaging,footprint, etc.) associated with the devices that they supply.Additionally, the company's material decision support system (MDSS) 308,based on feedback from the company's enterprise resource planning (ERP)and the supply chain 310, can update and/or augment procurement data(e.g., new manufacturers, preferred vendor status, discounts, etc.) inaggregated database 304. Further, a DFx/predictive modeling process 312can update and/or augment engineering data in database 304, based onfeedback from a PCB fabrication and assembly process 314.

In addition to providing feedback to aggregated database 304,DFx/predictive modeling process 312 can be invoked by CAD design 302 toanalyze a component design file. In the present embodiment, DFx analysisis performed as each device is placed in the design file by CAD design302. Thus, a designer would get a warning if the placement of a devicein the design file violated a design rule (e.g., wrong family ofdevices, etc.). Optionally, DFx review/predictive modeling 312 can beinvoked by a command from CAD design 312, either during or immediatelyafter the design of the component.

DFx programs are well known to those skilled in the art. It isconsidered to be a novel aspect of this invention, however, to implementDFx analysis at the design stage by a schematic design program. DFxanalysis and/or predictive modeling processes can be called by CADdesign 302 via an application program interface (API), or optionally canbe incorporated into the CAD design program 302 itself. In either case,embedding the engineering data in the design file makes DFx analysis andpredictive modeling possible at the earliest design stage.

When the component design is complete, the design file (or reportsgenerated therefrom) is passed to a product data manager (PDM) 316 fordocumentation and annotation of the design. The documentation andannotation of the design is accomplished, at least in part, by embeddingannotation data in the design file. This facilitates 2-way changeannotation should design revisions be necessary later.

ERP and supply chain process 310 receives the design file from PDM 316,and uses the design file, or reports generated therefrom (e.g., BOM), toprocure the devices necessary to manufacture the component. Prototypeand high volume manufacturing processes assemble the procured devicesand fabricated PCBs into finished products. Quality assurance,documentation, and manufacturing execution system processes 320 use thecompleted design file to document and monitor the manufacturing process318.

Lines 322 and 324 represent barriers that existed in the prior art,across which no feedback was provided to the designer. As shown in FIG.3, however, such feedback does occur in the inventive process of thepresent invention. In particular, feedback from manufacturing process318 to CAD design 302 is provided, via SMT machine programs 314 andDFx/predictive modeling process 312, by updating the DFx and predictivemodeling rules that are applied by DFx/predictive modeling process 312.Similarly, feedback is provided from ERP and supply chain data 310, viacompany MDSS 308, by updating the procurement data in aggregateddatabase 304. This feedback, as discussed above, reduces the number ofdesign revisions required to take a component from conception to highvolume manufacturing, as compared to prior art processes.

FIG. 4 is a block diagram illustrating the provision of supply chain(procurement) data and engineering data to the designer's desktop. Anaggregated database 402 of electronic devices includes supply chain data404, private engineering data 406, and public engineering data 408.Supply chain data 404 includes procurement data associated withelectronic devices, including but not limited to price, manufacturer,manufacturer preferred status, device availability, delivery terms, AMLfrequency, and demand. The majority of supply chain data 404 isdeveloped internally and depends on the business relations of thecompany. However, some supply chain data (e.g., standard price lists,etc.) may be available from public sources. In the present embodiment ofthe invention, supply chain data 404 is provided to aggregated database402 from the company MDSS 410. Private engineering data 406 includes butis not limited to the area, footprint, pinouts, parametric data,component geometries, etc., associated with the devices. Publicengineering data 408 includes data similar to private engineering data406, except that public engineering data 408 is provided by one or morepublic databases 412.

A set of filters 414 based on business rules and supply chain datafilters and sorts data presented to a designer's desktop 416. Forexample, a designer requests parts from database 402 by providing thedesired parametric data (e.g., a 100K resistor). The returned devices(all of the 100K resistors) are then sorted and presented to designer'sdesktop 416 based on the procurement data associated with the devices.For example, less expensive devices would be ranked higher than moreexpensive devices. As another example, devices from preferredmanufacturers would be ranked higher than devices from manufacturerswithout preferred status. As yet another example, devices that arereadily available would be ranked higher than devices that are backordered. The foregoing examples are provided by way of example only. Theparticular filtering scheme used will typically depend on the designer'spreference. In some cases, the various procurement data values can beassigned a hierarchical sort priority. In other cases, selectedprocurement data values will be combined in a weighted average.Regardless of how the devices are ranked, the designer will be presentedwith devices that exist in the company's supply chain, thereby reducingthe occurrence of procurement motivated design changes in the future.

FIG. 5 shows an example data structure 500 for procurement data providedfrom MDSS 410 to aggregated database 402. Data structure 500 includes anapproved manufacturers list (AML) table 502, a global pricing table 504,and an AML frequency table 506. The records of approved manufacturerstable 502 include a internal device part number field 508, a customername field 510, a manufacturer name field 512, a manufacturer's partnumber field 514, a manufacturer DUNS field 516, a device descriptionfield 518, and a manufacturer preferred status field 520. Device partnumber field 508 holds a number that identifies a device used for aparticular customer in a particular design. Customer name field 510holds data indicative of the customer for whom a component is beingdesigned. Manufacturer name field 512 holds data indicative of the nameof the manufacturer (or supplier) of the device. Manufacturer partnumber field holds data indicative of a unique part number assigned tothe device by the manufacturer. Manufacturer DUNS field 516 holds datathat is a standardized representation of the identity of themanufacturer. Device description field 518 holds data that provides abrief description of the device. Manufacturer preferred status field 520hold data indicative of a preferred status of the manufacturer. Forexample, some vendors are considered strategic partners (S), othervendors are considered core (C) vendors, and yet others have nonprefered(N) status. Of course, more or fewer manufacturer preference indicatorsmay be employed, depending on the needs, business relationships, etc. ofthe company.

Device part number field 508, manufacturer name field 512, andmanufacturer's part number field 514 are the key fields of table 502.Together, the manufacturer's name 512 and part number 514 uniquelyidentify a particular device from a particular manufacturer, and whencombined with device part number 508 uniquely identify each record intable 502.

The records of global pricing table 504 include a manufacturer namefield 522, a manufacturer DUNS field 524, a manufacturer's part numberfield 526, a price field 528, a region field 530, a terms of deliveryfield 532, and a comments field 534. Manufacturer name field 522 andmanufacturer's part number field 526 are the key fields of table 504,and together define a particular physical device from a particularmanufacturer. Manufacturer DUNS field 526 holds the same data as field516 of table 502. Price field 528 holds data indicative of the unitprice of the device. Prices from vendors around the world should beconverted to one common currency, so that prices can be compared. Regionfield 530 holds data indicative of the geographical region of themanufacturer (e.g., Europe, Asia, North America, etc.). Terms ofdelivery field 532 holds data indicative of the delivery terms (leadtime, delivery method, etc.) in place with the manufacturer. Commentsfield 534 is a free text field for storing any comments which may berelevant to device selection, or helpful to procurement staff.

The records of AML frequency table 506 include a manufacturer name field536, a manufacturer DUNS field 538, a manufacturer's part number field540, an AML frequency field 542, and a 3-month usage field 544.Manufacturers name field 536 and manufacturer's part number field 540are the key fields in table 506, and relate to fields 512 and 514 intable 502, and to fields 522 and 526 in table 504, respectively, asshown by the relational arrows in FIG. 5. The dual arrowheads on therelational arrows indicate that more than one record in table 502 caninclude a given combination of a manufacturer name and part number.Manufacturer DUNS 538 holds data similar the identically named fields inthe other tables.

AML frequency field 542 holds data indicative of the number of recordsin table 502 that have the same values in their manufacturer name fields512, 536 and their manufacturer part number fields 514, 540. In otherwords, how many customers and or projects has this particular devicefrom this particular manufacture been approved for. 3-Month usage field544 holds data indicative of the number of this particular device thathas been used during the preceding 3 months.

FIG. 6 shows an example data structure 600 for storing privateengineering data 406. Data structure 600 includes a parametric datatable 602, a geometric data table 604, and a package information table606. The records of parametric data table 602 includes a manufacturename field 608, a manufacturer's part number field 610, a device typefield 612, a value field 614, and a response function field 616.Manufacture name field 608 and manufacturer's part number field 610 arethe key fields, and relate to the identically named fields in datastructure 500 (FIG. 5). Indeed, this relationship provides a linkbetween private engineering data 406, supply chain data 404, and publicengineering data 408 (described below) of aggregated database 402.Device type field 612 holds data indicative of the kind of device(resistor, transistor, logic gate, etc.) represented by the record.Value field 614 holds data indicative of the value (100 ohms, AND gate,etc.) of the device. Response function field 616 holds data (e.g., amathematical function) capable of replicating the electroniccharacteristics of the device.

The records of geometric data table 604 include a manufacturer namefield 618, a manufacturer's part number field 620, a physical geometryfield 622, a footprint field 624, and a pinouts field 626. Manufacturername field 618 and manufacturer's part number field 620 are the keyfields of table 604 and relate to the fields of the same name in tables602 and 606 as shown, and to the same fields of the same name in datastructures 500 (FIG. 5) and 700 (FIG. 7). Physical geometry field 622holds data indicative of the physical dimensions (size, shape, etc.) ofthe device. Footprint field 624 holds data indicative of the footprint(shape and area) the device will occupy on the PCB. Pinouts field 626includes data indicative of the pin (electronic connections)configuration of the device.

The records of package information table 606 include a manufacturer namefield 628, a manufacturer's part number field 630, a package type field632, and a devices per package field 634. Manufacturer name field 628and manufacturer's part number field 630 are the key fields of table606. Package type field 632 holds data indicative of what type ofpackage (individual, DIP, etc.) the device comes in. Devices per packagefield 634 holds data indicative of the number of devices that come inthe particular package type. For example, multiple logic gates typicallyare available in one dual-inline package (DIP).

FIG. 7 shows an example data structure 700 for public engineering data408 to include a parametric data table 702. The records of parametricdata table 702 include a manufacturer name field 704, a manufacturer'spart number field 706, a device type field 708, and a value field 710.Manufacturer name field 704 and manufacturer's part number field 706 arethe key fields of table 702. Device type field 708 holds data indicativeof the kind of device, and value field 710 holds data indicative of theelectronic value of the device.

Although data structure 700 has fewer different fields than datastructure 600, in this particular embodiment table 702 will have farmore records than the tables of data structure 600. Indeed, it isdesirable that table 700 provide as complete a library of all availableparts from all manufacturers as possible. Then, a designer will be ableto find devices meeting his/her requirements, even if there is nocorresponding part in private engineering database 406.

There is no specific requirement that any particular type of data beheld in private engineering data 406 instead of public engineering data408. Rather, the decision of where to store the data depends more on thevalue of the data. Data that is sensitive, that is not freely availableto the public, that requires a significant investment of time anresources to accumulate, and/or that provides a competitive advantagewould typically be kept private.

The above-described data structures are provided by way of example, inorder to provide a clear explanation of the invention. Known DFx andpredictive modeling programs analyze a wide variety of characteristicsof component designs. In view of this disclosure, it should be clear toone skilled in the art that many additional data fields can be added tothe data structures shown herein, depending on the type and requirementsof the analytical programs utilized. The data structures shown hereinare kept relatively simple to avoid obscuring the invention withdatabase programming issues that are well known to those skilled in theart.

FIG. 8 is a block diagram of a system 800 for designing electroniccomponents according to one embodiment of the present invention. System800 includes a plurality of component design stations 802(1-m), anaggregated database 804, a DFx rules database 806, an MDSS 808, and amanufacturing process 810, all intercommunicating through an internalnetwork 812. Component design stations 802(1-m) include a schematicdesign tool with integrated DFx and procurement based decision-makingcapabilities, as will be described in greater detail. Aggregateddatabase 804 is similar to aggregated database 402 described withreference to FIGS. 4-7. DFx rules database 806 is a compilation of rulesthat are applied when component design stations 802 perform DFx analysisor predictive modeling on design files. MDSS provides procurement datato aggregated database 804 that is used by component design systems 802when selecting devices for placement in design files. Manufacturingprocess 810 is representative of facilities that manufacture thecomponents designed by design stations 802.

DFx rules database 806 provides a feedback mechanism from manufacturingprocess 810 to design stations 802. In particular, manufacturing process810 updates DFx rules database 806. Assume, for example, that aparticular design has a manufacturing design flaw that is not recognizedby the DFx analysis performed by design stations 802. When the designflaw is discovered in manufacturing process 810, manufacturing process810 will update the DFx rules to recognize that particular problem.Thus, the defect will not be repeated in subsequent designs, or insubsequent revisions of the same design. In contrast, according to theprior art, the manufacturing process would simply revise the design toremedy the defect. Then, the defect would be repeated in subsequentdesigns and/or subsequent revisions of the same design.

Aggregated database 804 can also be augmented and/or updated from aplurality of public databases 814(1-p) and/or the company's suppliers816(1-r) via an internetwork 818 (e.g., the Internet). A firewall 820protects private data in aggregated database 804 from unauthorizedaccess.

FIG. 9 is a block diagram showing one of design stations 802 in greaterdetail to include non-volatile data storage 902, one or more processingunits 904, working memory 906 (e.g., random access memory), userinput/output (I/O) devices 908, and one or more communication devices910, all intercommunicating via an internal bus 912. Nonvolatile datastorage 902 stores data and code that is retained even when designstation 802 is powered down. Typical examples of non-volatile datastorage include read only memory (ROM), hard disk drives, optical diskdrives, and other types of removable media. Processing unit(s) 904impart functionality to design station 802 by processing the executablecode stored in non-volatile data storage 902 and memory 906. Workingmemory 906 provides temporary storage for data and code being processedby processing unit(s) 904. User I/O devices 908 provide a means for thedesigner to interact with design station 802, and typically include suchdevices as a keyboard, a monitor, a printer, a pointing device, and thelike. Communication device(s) include devices such as a modem, and anetwork adapter that facilitates communication with the other devices onnetwork 812.

In order to clearly explain the operation of design station 802, thefunctionality of design station 802 is shown representationally as codeblocks in memory 906. Those skilled in the art will understand, however,that all of the code need not remain in memory 906 during the operationof design station 802. Indeed, processing unit(s) 904 will typicallyshuffle portions of the code into and out of memory 906 (e.g. to/fromnon-volatile data storage 902, databases 804, 806, etc.), for executionas required during operation. Further, although the functional blocks inmemory 906 are shown to be physically coupled, those skilled in the artwill understand that they are actually processes that communicate bycalling one another for execution.

As shown in FIG. 9, memory 906 includes an operating system 914, one ormore application programs 916, a schematic design tool 918, a schematicdesign file 920, a set of business and supply chain rules 922, a DFxanalyzer 924, a predictive modeling process 926, and a net list and BOMgenerator 928. Operating system 914 is a low level program upon whichthe other programs run. Application programs 916 is representative ofword processing programs, graphics programs, and the like, and isintended to show that design station 802 need not be dedicated solely toschematic design tool 918.

Schematic design tool 918, responsive to receiving data and commandsfrom a designer, is operative to create schematic design file 920, byadding electronic devices to design file 920 as follows. The designerinitiates the process of adding a device to design file 920 by providinga parametric value for the desired device. For example, the designer caninput the type and value of a device, such as a 100-ohm resistor.Schematic design tool 918 then queries aggregated database 804 fordevices satisfying the parametric requirements. Database 804 returnsrecords for all devices found to meet the search parameters, includingengineering and procurement data associated with the devices. Beforepresenting the returned devices to the designer for selection, however,schematic design tool 918 sorts and filters the data by applyingbusiness and supply chain rules 922 to the procurement data associatedwith the returned device records. For example, design tool 918 mightfilter out all devices that are not manufactured by a preferred vendor.As another example, design tool 918 might filter the returned devicesbased on price or availability. Additionally, design tool 918 invokesDFx analyzer to filter the returned device records by applying the DFxrules to the engineering data associated with the returned devices,thereby removing any devices whose addition to design file 920 wouldviolate DFx rules (e.g., incompatible device types).

The explanation of the operation of design tool 918 will proceed withadditional reference to FIG. 10, which shows an example data structurefor design file 920. Design file 920 includes a linked list of objects1002(1-x). Each of objects 1002 represents a device in design file 920,and includes drawing image data 1004, parametric data 1006, procurementdata 1008, geometric data 1010, connection data 1012, annotation data1014, and a link to the next object 1002 in the list. Drawing image data1004 is used to generate an image of a symbol representing the device ona display screen, printout, or the like. The content of parametric data1006, procurement data 1108, and geometric data 1010 is described above.Connection data 1012 indicates the electronic connections (e.g., pin topin) to other objects in design file 920. Annotation data 1014 storesannotations (e.g., revisions, etc.) to design file 920, and next objectlink 1016 provides the address of the next object in the linked list.

Referring again to FIG. 9, once the returned devices are sorted andfiltered, design tool 918 presents the sorted devices to the designerfor selection. The designer then inputs his selection via I/O devices908, identifying one of the presented devices as the selected device.Next, design tool 918 adds an object 1002 representative of the selecteddevice into design file 920, and associates the procurement andengineering data records with the newly added object by writing thedevice's procurement data to field 1008, and writing the device'sengineering data to parametric data field 1006 and geometric data field1010. Optionally, links to the procurement and engineering data can bewritten to object 1002, instead of the data itself.

Once an object 1002 is added to design file 920, the designer canestablished electronic connections with other objects in design file920. Responsive to input from the designer (e.g., drawing a connectingline with a pointing device), schematic design tool 918 enters data inthe connection data fields 1012 of the objects being linked. Theconnection data indicates which pins/terminals are connected. DFxanalyzer 924 checks to ensure that the connections do not violate any ofthe DFx rules.

The designer continues placing and connecting devices in design file920, until the design is complete. When design file 920 is complete, theprocurement and engineering data associated with the objects 1002 indesign file 920 enable the use of a variety of design analyzers andtools that will expedite the manufacturing process. For example, DFxanalyzer 924 can now be invoked again to analyze design file 920. Thetest run by DFx analyzer 924 include, but are not limited to, design formanufacturability, design for testability, design for fabrication,design for procurement, design for reliability, and design for quality.Additionally, predictive modeling process 926 can analyze the operationof the designed circuit, using the parametric data and connection dataassociated with the objects 1002 in design file 920.

Further, tools such as Net list and BOM generator 928 can operate ondesign file 920 to generate reports or files that help expeditesubsequent stages of the manufacturing process. Net list and BOMgenerator 928 automatically generate a net list and a BOM from theengineering and procurement data associated with the objects 1002 indesign file 920. In the prior art, such reports were compiled manuallyfrom a schematic drawing, which contained only symbols of devices. Theprocesses were time intensive and prone to errors. The automaticgeneration of such reports according to the present invention provides asignificant savings of time and a significant reduction in errors ascompared to the manual methods of the prior art.

All that is required to enable a particular tool or analyzer is that thedata required for a particular analysis or tool be embedded in (orlinked to) the objects 1002 placed in the design file 920 during thedesign stage. Indeed, it is expected that, in view of this disclosure,additional analyses and tools will be developed, and the data requiredfor such analyses will be provided to aggregated database 804, andassociated with the devices stored therein.

FIG. 11 is a flow chart summarizing one particular method 1100 fordesigning an electronic component according to one aspect of the presentinvention. In a first step 1102, the designer selects a device foraddition to a design file based on procurement data associated with thedevice. Then, in a second step 1104, engineering data associated withthe selected device is retrieved. Next, in a third step 1106, an objectis inserted in the design file, and the object is associated with theprocurement and/or engineering data. In a fourth step 1108, DFx analysisis performed to ensure that the addition of the device to the designfile does not violate any design rules. Then, in a fifth step 1110, thedesigner determines whether the design is complete. If not, then method1100 returns to first step 1102 to select another device for addition tothe design file. If the design is complete, then method 1100 proceeds toa sixth step 1112, where post design analyses are performed, and postdesign reports are generated. Then, the design method 1100 ends.

FIG. 12 is a flow chart 1200 summarizing one particular method forperforming first step 1102 of method 1100 for selecting a device basedon procurement data. In a first step 1202, the system receives a searchcriteria (e.g., a parametric value) from the designer. Then, in a secondstep 1204, a database is queried for devices corresponding to the searchcriteria. Next, in a third step 1206, the database is queried forprocurement data associated with the returned devices. Note that thedatabase queries of steps 1104, 1204, and 1206 can, and most likelywould, be performed simultaneously as a single query. Next, in a fourthstep 1208, the devices returned in response to the queries are filteredand/or sorted based on the procurement and/or design data associatedwith the returned devices and presented to the designer. Then, in afifth step 1210, the designer's selection of one of the presenteddevices is received by the system, and device selection method 1200ends.

The description of particular embodiments of the present invention isnow complete. Many of the described features may be substituted, alteredor omitted without departing from the scope of the invention. Forexample, alternate data structures may be substituted for the datastructures. As another example, additional and/or different engineeringand/or procurement data can be included in the objects of the designfile. Further, additional and/or different analyses and reports can begenerated from the different/additional data. These and other deviationsfrom the particular embodiments shown will be apparent to those skilledin the art, particularly in view of the foregoing disclosure. Indeed,the examples presented herein are intended to be relatively simple, soas not to obscure the invention with details well know to software anddatabase programmers.

Further, those skilled in the art will recognize that the presentinvention includes several novel aspects, which are considered to beinventive both individually and in combination with one another.Therefore, no single aspect of the present invention should beconsidered an essential element of the present invention. Indeed, it isanticipated that in various particular embodiments one or more inventivefeatures of the invention may be omitted, while retaining otherinventive features.

1. A method for designing an electronic component comprising: placingobjects representing electronic devices in a design file; defininginterconnections between said devices in said design file; associatingengineering data with said objects in said design file; and performingin a computer system, a DFx analysis on said design file for compliancewith a set of predetermined DFx design rules at the design stage; andwherein said step of performing said DFx analysis occurs as said objectsare placed in said design file.
 2. A method according to claim 1,further comprising: generating a schematic following said designanalysis; and using said schematic to design a printed circuit board forsaid electronic component.
 3. A method according to claim 1, furthercomprising: generating a net list from said design file following saiddesign analysis; and using said net list to design a printed circuitboard for said electronic component.
 4. A method according to claim 1,further comprising: retrieving procurement data from a procurementdatabase; associating said procurement data with said objects in saiddesign file; and performing a procurement analysis on said design fileat the design stage.
 5. A method according to claim 4, furthercomprising: generating a bill of materials from said design filefollowing said procurement analysis; and using said bill of materials toinitiate a procurement process.
 6. A method according to claim 4,further comprising: updating said procurement data in said procurementdatabase based on said procurement analysis; and providing feedback to adesigner based on said update procurement data.
 7. A method according toclaim 1, further comprising: updating at least one design ruleassociated with said DFx analysis based on a manufacturing process; andproviding feedback to a designer based on said at least one updateddesign rule.
 8. A computer readable medium having code embodied thereinfor causing an electronic device to perform the steps of the method ofclaim
 1. 9. A system for designing an electronic component, said systemcomprising: a database including a plurality of data files representingindividual electronic devices; a schematic design tool responsive toreceiving data and commands from a designer, and operative to placeobjects representing electronic devices in a design file, to defineinterconnections between said objects, and to associate engineering datawith said objects; and a DFx analyzer operative to analyze said designfile for compliance with a set of predetermined DFx design rules at thedesign stake; and wherein said DFx analyzer is operative to analyze saiddesign file as said objects are placed in said design file.
 10. A systemaccording to claim 9, further including a schematic generator operativeto generate at least one schematic from said design file following saidDFx analysis of said design file.
 11. A system according to claim 9,further including a net list generator operative to generate a net listfrom said design file following said DFx analysis of said design file.12. A system according to claim 11, wherein said net list is used todesign a printed circuit board for said electronic component.
 13. Asystem according to claim 9, wherein said schematic design tool isoperative to retrieve procurement data from a database and to associatesaid procurement data with said objects in said design file, therebyenabling a procurement analysis on said design file at the design stage.14. A system according to claim 13, wherein said schematic design toolis operative to initiate said procurement analysis.
 15. A systemaccording to claim 14, further including a bill of materials generatoroperative to generate a bill of materials from said design file.
 16. Asystem according to claim 15, wherein said bill of materials is used toinitiate a procurement process.
 17. A system according to claim 13,further comprising a procurement feedback mechanism providing feedbackfrom at least one procurement process to said designer.
 18. A systemaccording to claim 9, further comprising a manufacturing feedbackmechanism providing feedback from at least one manufacturing process tosaid designer.
 19. A system for designing an electronic component, saidsystem comprising: a database including a plurality of data filesrepresenting individual electronic devices; a schematic design toolresponsive to receiving data and commands from a designer, and operativeto place objects representing electronic devices in a design file, todefine interconnections between said objects, and to associateengineering data with said objects; and means for analyzing said designfile for compliance with a set of predetermined design rules during atthe design stage; and wherein said means for analyzing said design fileis operative to analyze said design file as said objects are placed insaid design file.